solder test

  1. Hioki Four-Wire Method detects Latent Solder Joint Defects

    At the IPC Apex 2014 Conference and Exhibition for the electronics manufacturing industry last year, Hioki presented a paper revealing that it has developed a four-wire solder joint integrity test for finding latent defects in PCBs that would otherwise go undetected by conventional tests such as capacitance method and boundary scan, among others. Continue reading →
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